SHENMAO America, Inc. announces the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder paste offers exceptional anti-thermal fatigue reliability, making it an ideal solution for demanding AI applications. The PF719-P250A solder paste utilizes a newly developed, high-reliability lead-free alloy that provides excellent anti-thermal […]
thermoelectric coolers
Dual-channel gate drivers offer thermal management for inverter modules
Power Integrations has announced the launch of the SCALE-iFlex XLT family of dual-channel plug-and-play gate drivers. These drivers are designed for the operation of single LV100 (Mitsubishi), XHP 2 (Infineon), HPnC (Fuji Electric), and equivalent semiconductor modules up to 2300 V blocking voltage. The new gate drivers are suitable for wind, energy storage, and solar […]
A new technique for improving performance in Peltier modules
Peltier modules or thermoelectric coolers (TEC) have grown in popularity and found uses in many applications due their reliable solid-state construction and precise temperature control. They operate by transferring heat from one side of the module to the other when electrical power is applied. Although all Peltier devices are constructed using the same general structure, […]
Micro Peltier modules offer compact footprints as small as 3.4 mm
CUI Devices’ Thermal Management Group announced the expansion of its Peltier module product line with the addition of micro Peltier modules. Carrying compact package sizes with dimensions from 3.4 mm to 9.5 mm and profiles as low as 1.95 mm, these micro Peltier modules offer reliable solid-state construction, precise temperature control, and quiet operation for […]
