Navitas Semiconductor has released an 8.5 kW power supply unit (PSU) that utilizes GaN and SiC technologies and has achieved 98% efficiency for AI and hyperscale data centers. The AI-optimized 54V output PSU meets Open Compute Project (OCP) and Open Rack v3 (ORv3) specifications. It incorporates GaNSafe and Gen-3 Fast SiC MOSFETs in 3-phase interleaved […]
AI
Three-component power system targets AI laptop applications
Renesas Electronics Corporation has developed a power management solution for laptops based on the Intel® Core™ Ultra 200V series processors, focusing on battery efficiency for AI applications. The power management system consists of three components: the RAA225019 PMIC, RAA489301 pre-regulator, and ISL9241 battery charger. The RAA225019 PMIC incorporates integrated power MOSFETs and current sensing circuitry, […]
Power modules target data center energy reduction amid AI growth
Infineon Technologies AG is launching the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers. These modules enable true vertical power delivery (VPD) and offer the industry’s best current density of 1.6 A/mm 2. They follow the TDM2254xD dual-phase power modules introduced by Infineon earlier this year. The TDM2354xD and TDM2354xT […]
Lead-free alloy solder paste addresses thermal fatigue in AI applications
SHENMAO America, Inc. announces the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder paste offers exceptional anti-thermal fatigue reliability, making it an ideal solution for demanding AI applications. The PF719-P250A solder paste utilizes a newly developed, high-reliability lead-free alloy that provides excellent anti-thermal […]
ORv3-compatible racks with integrated liquid cooling for AI workloads
Flex has introduced a range of new products and partnerships aimed at addressing the growing demands of AI and high-performance computing (HPC) applications. The company announced customizable compute reference designs incorporating JetCool’s SmartPlate direct-to-chip liquid cooling solution, capable of cooling over 1,500W per socket. In collaboration with JetCool, Flex is set to deliver liquid-cooled solutions […]
Asymmetrical TVS diode protects SiC MOSFETS
Littelfuse, Inc. announced the SMFA Asymmetrical Series Surface-Mount TVS Diode, the first-to-market asymmetrical TVS solution specifically designed to protect Silicon Carbide (SiC) MOSFET gates from overvoltage events. As SiC MOSFETs become increasingly popular due to their faster switching speeds and superior efficiency compared to traditional Silicon MOSFETs and IGBTs, the need for robust gate protection […]
SiC MOSFETs optimized for AI, EV, and solar systems
Navitas Semiconductor announces the launch of their new Gen-3 ‘Fast’ (G3F) 650 V and 1,200 V SiC MOSFETs, designed for applications such as AI data center power supplies, on-board chargers (OBCs), fast EV roadside chargers, and solar/energy-storage systems (ESS). This new portfolio covers industry-standard packages from D2PAK-7 to TO-247-4, tailored for high-power, high-reliability applications. The G3F […]
Next-gen, 400 V MOSFET family for advanced AI server power supplies
With the increasing power requirements of Artificial Intelligence (AI) processors, server power supplies (PSUs) must deliver more and more power without exceeding the defined dimensions of the server racks. This is driven by a surge in energy demand for high-level GPUs, which could consume 2 kW or more per chip by the end of the […]
Upcoming EE Training Day: optimizing thermal performance and system design of AI datacenter servers
This webinar will be held on May 16th, 2024, at 2 pm ET. As the demand for AI/ML tasks increases, effective thermal control within data centers becomes essential. This webinar will explore advanced thermal regulation techniques crucial for maintaining optimal performance amidst rising thermal pressures. It will also examine inventive cooling methods crafted to uphold […]
Versatile, ac-dc power supply for medical and industrial use
TDK Corporation announces the introduction of the TDK-Lambda brand CUS800M and CUS1000M AC-DC power supply series in a 6.73 x 3.35 x 1.67” (171 x 85 x 42.5mm) case size. Rated at up to 800W and 1000W, these very compact products also feature a variable speed fan with typically 30 – 42dBA audible noise. The […]
