The NEX806xx/NEX808xx are quasi-resonant/multi-mode flyback controllers that operate from a wide VCC range (10-83V), while the NEX81801/NEX81802 are adaptive synchronous rectifier controllers. These ICs can be used in combination with Nexperia’s NEX52xxx PD controllers and other discrete power devices to deliver a turn-key flyback converter solution that optimizes the current sense voltage level and PFM mode, reduces standby power, and achieves high efficiency across the entire load range. The primary side controller can be used to drive a silicon MOSFET or GaN high electron mobility transistor (HEMT) directly, which helps to improve power density, while the synchronous rectification (SR) controller utilizes an innovative adaptive control method to eliminate the possibility of mis-conduction of switching device, thereby improving overall system reliability. 

This family of flyback controller ICs employs the TSOT23-6 flip-chip package to deliver better thermal performance which also helps to prevent accidental triggering of the over-temperature protection (OTP) function. The control circuit also includes additional protection features, making it ideally suited for use in consumer and industrial flyback power supply designs.

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The AP33771C and AP33772S control DC power requests in USB Type-C connector-equipped devices, supporting PD3.1 EPR up to 140W and adjustable voltage supply (AVS) up to 28V. They can outperform other competing devices that typically only support up to AVS 21V. For maximum flexibility in systems without an MCU, the AP33771C offers multiple power profiles including eight resistor-settable output voltage levels and eight output current options. Alternatively, the AP33772S features an I2C communications interface for systems with a host MCU.

Both the AP33771C and AP33772S feature smart, standard built-in firmware for practical applications like LED light indication, cable voltage drop compensation, and moisture detection. While no programming is required to activate this feature in the AP33771C, designers have the option of using I2C commands to configure the AP33772S. These sink controllers also feature 34V tolerant CC pins to offer robust system protection against accidental shorts to the high-voltage VBUS. The sink controllers also help to reduce the bill of materials (BOM) by supporting NMOS FETs for input voltage delivery.

The AP33771C is available in the small-footprint W-DFN3030-14 (Type A1) (3mm x 3mm) package at $0.79 in 1,000 piece quantities, while the AP33772S is available in the W-QFN4040-24 (Type A1) (4mm x 4mm) package at $0.84 in 1,000 piece quantities.

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The new SiPs, WT7162RHUG24B and WT7162RHUG24C, integrate Weltrend’s high-frequency multi-mode (QR/Valley Switching) Flyback PWM controller with Transphorm’s 150 mΩ and 480 mΩ SuperGaN FETs, respectively. Like their 240 mΩ predecessor (WT7162RHUG24A), the devices pair with USB PD or programmable power adapter controllers to provide a total adapter solution. The new SiPs also offer several innovative features, including the UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control, which allow customers to design high-quality power supplies faster and with fewer components using a simpler design approach.

According to Wayne Lo, Vice President of Marketing at Weltrend, “When we launched our first GaN SiP last year, it was an important milestone in our company’s evolution. It demonstrated a new GTM strategy for the AC-to-DC power market. Today’s news confirms we’re continuing to serve that space with a wider selection of devices designed to support a wider assortment of product power levels. A total packaged solution with Transphorm’s SuperGaN platform delivers design simplicity with unparalleled performance for devices now ranging from low 30-watt USB-C PD power adapters through to nearly 200-watt chargers, a unique Transphorm GaN capability.”

End product manufacturers seek ways to develop new adapters with a reduced bill-of-materials (BOM) that offer versatility, fast charging, and higher power outputs. Additionally, in many cases, they seek to deliver “one-size-fits-all” chargers with multiple ports and/or multiple types of connections, all in a smaller, lighter-weight form factor.

Some key advantages of Transphorm’s normally-off d-mode SuperGaN platform include best-in-class robustness (+/- 20 V gate margin with a 4 V noise immunity) and reliability (< 0.05 FIT) with the ability to increase power density by 50% over silicon. Weltrend’s elegant SiP designs harness those advantages along with its own innovative technologies to create a near plug-and-play solution that speeds design while reducing form factor size.

“SiPs are an important device option when considering the needs of adapter and charger manufacturers,” said Tushar Dhayagude, Vice President of Worldwide Sales and FAE at Transphorm. “These systems require effective power conversion that, while simple to use with integrated functionality, also minimize learning curves to ensure quick design in. The first device released validated the performance and versatility of a SuperGaN SiP. The new devices announced today validate both our companies’ deepening commitment to arming customers with choice.”

The two new devices, WT7162RHUG24B and WT7162RHUG24C, are currently sampling. Contact sales@weltrend.com.tw for more information.

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