Power Electronic Tips

Evaluation kit aims to simplify low-power wireless charging design

Redding Traiger — Mon, 07 Oct 2024 16:39:48 +0000

Eggtronic has unveiled a new evaluation board that allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications. The WaveEgg Low-Power (LP) EVB is built on Eggtronic’s proprietary, high-frequency WaveEgg architecture, which optimizes performance and efficiency and reduces component count and form factor in high-performance power converter and wireless power transmission systems. Ideally suited to wirelessly charging and powering small, smart devices and IoT products, WaveEgg delivers powers between 0.5 W and 30W and can work at extremely high frequencies (from some MHz to tens of MHz, including ISM 6.78 – 13.56 – 27.12 MHz).

WaveEgg offers end-to-end efficiency that is significantly higher than traditional systems while allowing the overall bill of materials (BoM) to be reduced. Using the WaveEgg LP EVB, engineers will be able to create systems with high low-load to full-load efficiency using fewer components than standard class D, class-E, class F, class Phi, and other resonant wireless power transfer solutions – including Qi, – and Airfuel-based technologies.

WaveEgg is based on Eggtronic’s EPIC (Eggtronic Power Integrated Controller) ICs. These ICs integrate a 32-bit RISC-V core and high-performance digital and analog peripherals and feature a flexible internal structure that supports control of both standard and proprietary power conversion architectures. High efficiency over the whole load range is achieved through a proprietary design that achieves zero-voltage-switching (ZVS) and quasi-zero-current-switching (quasi-ZCS) on the transmission side and ZVS+ZCS on the receiving side.

At an output of 6W and a switching frequency of 2 MHz, WaveEgg achieves an efficiency of 85%. The requirement for fewer components than conventional designs further contributes to efficiency by reducing losses from non-ideal component behavior. Additional component count reduction is possible for battery charging applications as the receiver is also capable of charging a battery through a step-down converter implementing a CC/CV mode algorithm, eliminating the need for a battery charger controller.

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IC protects battery backup systems from too much voltage and current

Redding Traiger — Fri, 10 May 2024 19:28:28 +0000

Littelfuse, Inc.has revealed the newest member of its eFuse Protection IC lineup, the LS0502SCD33S. This novel development introduces the Single Cell Super Capacitor Protection IC, tailored explicitly for charging backup power sources under extreme conditions, setting a new benchmark in the sector.

Backup power is essential in numerous settings, but lithium-ion batteries’ limited temperature tolerance often restricts their application. In response, Littelfuse engineered the LS0502SCD33S, leveraging supercapacitor technology to deliver a solution that excels in a broad temperature range and offers superior power/energy density. This single-cell approach ensures a reliable and compact backup option.

A standout feature of the LS0502SCD33S is its proficiency in effortlessly managing high operational voltages (above 3 V), eliminating the necessity for intricate power management arrangements. The LS0502SCD33S protects against potential system impairments with its integrated input overvoltage and current protection mechanisms. It offers an adaptable, all-in-one, and space-efficient solution for storage capacitors or capacitor banks. Additionally, it incorporates an ideal diode for reverse blocking to maintain performance and efficiency when the input voltage drops.

The LS0502SCD33S Single Cell Super Capacitor Protection IC is ideally suited for various SuperCap uses, such as: Automotive dash cameras; Smart utility meters; IoT gadgets; Industrial handheld devices; Portable electronics with removable batteries.

The LS0502SCD33S stands out by supporting an extensive array of protection functionalities, such as Over-Current Protection (OCP) and Over-Voltage Protection (OVP), while also being energy-efficient and facilitating automatic primary/backup switchover, distinguishing it from competing products.

Beyond its protective capabilities, the LS0502SCD33S offers numerous advantages. It enhances reliability and extends the lifespan, helping manufacturers lower maintenance costs. Moreover, it promotes extended battery durability and minimizes the end-products’ size due to its compact design, an essential feature for devices that require prolonged standby times.

The LS0502SCD33S is a comprehensive backup storage capacitor system solution that integrates input overvoltage, overcurrent protection, a reverse blocking switch, and supercapacitor charging control circuits. It ensures balanced charging for two-cell supercapacitor configurations, operates with a minimal 2.5 μA current draw after the storage component is fully charged, and signals the disconnection of the input supply, allowing the primary system to react swiftly.

The eFuse Single Cell Protection ICs are available in tape and reel format in quantities of 5,000.

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Power MOSFET supports USB-PD 3.1 buck-boost converters

Redding Traiger — Thu, 28 Mar 2024 19:53:10 +0000

Alpha and Omega Semiconductor Limited announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications. The USB PD 3.1 EPR increases the USB-C maximum power up to 240W. AONZ66412 is defined to support the most commonly addressed power range of up to 140W at 28V, with two 40V N-Channel MOSFETs in a half-bridge configuration in a symmetric XSPairFET 5mmx6mm package.

The AONZ66412 can replace two single DFN5x6 MOSFETs, reducing the PCB area and simplifying the layout of the 4-switch buck-boost architecture while enabling a higher efficiency design. These benefits make the AONZ66412 ideal for buck-boost converters in Type-C USB 3.1 EPR applications, including notebook, USB hub, and power bank designs.

The AONZ66412 is an extension to the AOS XSPairFET lineup that features the latest bottom source packaging technology and lower parasitic inductance for reduced switch node ringing. Engineered with integrated high-side and low-side MOSFETs (3.8mOhms maximum on-resistance for each FET) within a DFN5x6 symmetric XSPairFET package, the low-side MOSFET source of the AONZ66412 is connected directly to a large paddle on the lead frame. This allows for improved thermals, as this paddle can be directly connected to the ground plane on the PCB. The improved package parasitics make 1MHz operation achievable, allowing inductor size and height to be reduced. AONZ66412 has been tested to achieve 97% efficiency @1MHz in typical USB PD 3.1 EPR conditions of 28V input, 17.6V output, and 8A load conditions.

The AONZ66412 is immediately available in production quantities with a lead time of 16 weeks. The unit price in 1,000-piece quantities is $1.56.

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