Texas Instruments (TI) introduced six new power modules aimed at enhancing power density, efficiency, and EMI reduction. These modules utilize TI’s MagPack integrated magnetic packaging technology, reducing size by up to 23% compared to competitors.

These power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules. This enables designers of industrial, enterprise, and communications applications to achieve previously impossible performance levels. Three of the six new devices, the TPSM82866A, TPSM82866C, and TPSM82816, are the industry’s smallest 6A power modules, supplying an industry-leading power density of nearly 1A per 1mm2 of area.

The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density and reduce temperature and radiated emissions while minimizing both board space and system power losses. These benefits are especially important in applications such as data centers, where electricity is the biggest cost factor. Some analysts predict a 100% increase in demand for power by the end of the decade.

This advancement enables designers in the industrial, enterprise, and communications sectors to achieve heightened performance levels.

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The front end of the design utilizes Pulsiv OSMIUM technology to efficiently manage the AC to DC conversion process with zero inrushes current and no input voltage derating. Using an intelligent active valley fill approach, this patented method also enables the use of smaller system components compared to conventional designs. The DC-DC converter in the 65W variant is based on an industry-standard QR flyback. However, when combining a Pulsiv OSMIUM front-end design with optimized magnetics from Frenetic, it is now possible to use an EQ20 core, which provides a 20% reduction in the flyback transformer size.

Pulsiv continues to demonstrate innovation by delivering cost-effective, energy-efficient, and sustainable power electronics designs that benefit billions of devices. To accelerate and simplify the design process, three options will be offered:

Reference designs
Complete reference designs will be made available on the Pulsiv website, where engineers can download a document package that includes a datasheet, schematic, bill of materials, and EMC test data.

Finished modules
Fully assembled, ultra-compact, and EMC-compliant finished modules will be produced by Pulsiv to demonstrate a size-optimized design and enable rapid prototyping of each reference design. They can also be easily integrated into end products without incurring any further design, development, or manufacturing costs.

Evaluation boards
Evaluation boards will be developed for customers who wish to test and/or adapt the design for their own requirements and will be stocked by a number of distribution partners. A datasheet with a schematic, bill of materials, EMC test data, Gerbers, and PCB layout files will also be available.

SpecificationPre-register interest
To register your interest in this exciting new development and receive full product details upon launch, please click here.

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CUI Devices’ arcTEC structure is one such advanced construction technique that utilizes three enhancements (thermally conductive resin, high temperature solder, and larger P/N elements) to greatly improve performance, reliability, and lifespan.

The CUI Insights blog post, “arcTEC Structure – Improved Performance and Longer Life in Peltier Modules” dives into these improvements in more detail, while providing an overview of Peltier module technology.

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