The solution eliminates the need for daisy-chain communication and wiring by using wireless technology to enable communication between batteries and the control unit. Compared to previous wired distributed solutions, the new wBMS developed by the company reduces the wiring harness by 90% and simplifies the battery cell construction and installation. In particular, the wBMS reduces complexity in the assembly and grants more flexibility for battery module placement.

The reduced weight due to connectors removal allows for more energy efficiency, thus increasing the driving range of the vehicle with the same charge. The solution also opens up room in the battery pack to allow larger batteries to fit, guaranteeing versatility, scalability, and optimization; ultimately, under the right circumstances, larger batteries also translate to enhanced power performance and again extended vehicle range.

The Marelli wBMS can be delivered with a highly sophisticated software application layer that uses advanced algorithms based on a proprietary technique so-called “Sensor Fusion”. The algorithms estimate several crucial parameters of each battery cell – including the State of Charge, State of Health, and the State of Power – to ensure a more accurate calculation of the battery’s overall status, and inform the other components of the powertrain accordingly.

Developing an advanced Battery Management System is a fundamental task for the Electric Vehicles design since it is a core and smart component in the complex architecture of EV energy management. The BMS represents the “brain” of the battery, manages the stored power and the capacity of the battery to deliver energy to the rest of the vehicle, checks and delivers information on the battery operating conditions and status, and ultimately monitors, optimizes,s and protects the battery.

In addition to this new wireless solution, Marelli already has a consolidated experience in the development of integrated and distributed BMS architectures over the years. These solutions are part of Marelli’s complete portfolio of modular technologies for vehicle energy management, which include a full selection of single components, as well as subsystems, up to solutions for the complete integrated vehicle energy management system. Complemented by proven e-powertrain and thermal design competencies, the battery management capabilities contribute to Marelli’s integrated approach, aimed at assure flexible and customizable solutions to control, manage and optimize the energy balance in electric vehicles.

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Dr Denis Marcon, General Manager, Innoscience Europe comments: “Our aim is to ensure that every power electronics designer – no matter where they are based – can benefit from the efficiency, power and size advantages that GaN technology brings. That is why we have invested in huge capacity – the largest in the world. Distribution is also a big part of our plans, and we are excited and honoured to announce WPG – the world’s largest semiconductor distributor – as our first global supply chain partner.”

Adds Nigel Watts, VP, WPG EMEA: “GaN is set for explosive growth as all markets – consumer, communications, automotive, industrial – experience the leap forward in end-product performance they can achieve by switching from traditional silicon-based power devices to GaN. Innoscience is the world’s largest 8-inch GaN-on-Si device manufacturer with a capacity of 10,000 8-inch wafers per month (WPM) – which is set to grow to 70,000 WPM by 2025. Therefore it is fitting that Innoscience have signed a global franchise deal with WPG. Product is available NOW and lead-times are far better than the traditional Silicon alternatives. Design now and manufacture sooner.”

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As digital ICs evolve to offer more features at lower voltages, resolving issues like noise and voltage fluctuation is critical. The solutions’ <40µm profile enables chip designers to embed the silicon capacitor into the package as close to the active die as possible to minimizing both the current path length and parasitic levels.

These multi-terminal devices satisfy the various SoC and microprocessor design requirements for multiple terminal capacitor networks. Replacing conventional monolithic ceramic capacitors with multi-terminal silicon devices reduces the total quantity of capacitors required on the board significantly, which improves the compactness of the end design. Fewer capacitors also result in savings in both bills of materials and mounting costs.

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