DC motors are available in various electrical configurations and, except for brushless DC (BLDC) motors, are relatively simple devices. As a result, driving brushed DC motors is a relatively simple process. As shown below, BLDC motors require a more sophisticated approach. A “motor drive” is not even necessary with brushed dc (BDC) motors in some […]
Motors and motor control
Three-phase half-bridge driver ICs control brushless motors for e bikes, power tools
STMicroelectronics has created an integrated three-phase half-bridge driver IC with performance optimized for low-voltage industrial applications up to 75V, delivering a space-efficient and power-saving solution to control three-phase brushless motors in e-bikes, power tools, pumps, fans, light machinery, gaming consoles, and other equipment. The STDRIVE101 embeds three half-bridge drivers for external N-Channel MOSFETs, each able to sink […]
Power module integrates 6-channel 1.2-kV gate drivers, SiC MOSFETs
Infineon Technologies AG has launched a 1200 V transfer molded silicon carbide (SiC) integrated power module (IPM) and concludes the massive roll-out of SiC solutions for this year. The CIPOS Maxi IPM IM828 series is the industry’s first in this voltage class. The series provides a compact inverter solution with excellent thermal conduction and a […]
Offline converter IC integrates PWM, control components
The latest addition to the VIPerPlus series, the VIPer31 compact high-voltage converter IC from STMicroelectronics enables robust power-converter solutions that deliver excellent reliability and meet energy-saving eco-design norms while saving bill-of-materials (BoM) costs. VIPer31 is optimized for commonly used offline AC/DC converter topologies, including isolated and non-isolated flyback, buck, and buck-boost converters. The compact, highly integrated IC requires […]
Three-phase IGBT, MOSFET gate drivers carry 1.2 kV ratings
Infineon Technologies AG broadens its level-shift EiceDRIVER portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a […]
SMD Metal-Foil-on-Ceramic resistors boast high surge tolerance, low self-heating
TT Electronics announced the introduction of its Metal Foil Chip (MFC) resistors. The MFC series uses metal foil on ceramic technology, which combines the heat spreading properties of a ceramic substrate with the surge tolerance of a bulk metal alloy resistance element. This, in turn, offers lower self-heating levels than thick-film or metal strip resistors and better surge tolerance than thick-film options, making these resistors particularly well-suited for automotive, industrial, and medical […]
SMD MOSFETs cut losses in motor drive applications
Infineon Technologies AG supports the robotics and automation industry in implementing maintenance-free motor drive inverters. By introducing the new CoolSiC MOSFET with.XT interconnection technology in a 1200 V optimized D 2PAK-7 SMD package, passive cooling becomes possible. Up to 80 percent loss reduction compared to a silicon-based solution eliminates the need for cooling fans and […]
Low-profile three-phase supply outputs up to 200 Vdc
XP Power announces the addition of a low-profile enclosure to the HPT5K0 series of high-power density, high efficiency, 5kW AC-DC power supply modules. In common with the existing products in the range, the new HPT5K0-L units feature a three-phase, three-wire & earth, 180 to 528VAC input and they carry ITE/industrial and medical agency approvals. The […]
Low-cost power modules target motor control, ATE, medical, imaging apps
RECOM has partnered with a global OSAT company (Outsourced Semiconductor Assembly and Test) to extend its range of low-cost power modules. The RPX-1.0 and RPX-1.5 buck converters in miniature, thermally-enhanced 3mm x 5mm QFN packages with 1.6mm profile and feature innovative 3D power packaging technology. Construction is over-molded ‘Flip Chip on Leadframe’ (FCoL) with an integrated, […]
Motor-control MCUs include AI-based failure detection, predictive maintenance
Renesas Electronics Corporation announced the extension of its microcontroller (MCU) portfolio designed for motor control applications targeting smart homes, industrial automation, and building automation. Featuring a rich set of peripheral functions and AI-based failure detection, the four new RA6T1 Group MCUs are the latest members of Renesas’ rapidly expanding Arm-based RA Family, and the first […]
