The 100 V OptiMOS 5 Linear FET 2 is available in a TO-leadless package (TOLL) and offers a 12 times higher SOA at 54 V at 10 ms and 3.5 times higher SOA at 100 µs compared to a standard OptiMOS 5 with similar R _DS(on). The latter improvement is particularly important for the battery protection performed inside the battery management system (BMS) in case of a short circuit event. During such events, the current distribution between parallel MOSFETs is critical for the system design and reliability. The OptiMOS 5 Linear FET 2 features an optimized transfer characteristic that allows for improved current sharing. Taking into account the wide SOA and improved current sharing, the number of components can be reduced by up to 60 percent in designs where the number of components is determined by the short-circuit current requirement. This enables high power density, efficiency, and reliability for battery protection which is used in a wide range of applications including power tools, e-bikes, e-scooters, forklifts, battery backup units, and battery-powered vehicles.

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A new 8.5 kW power supply for AI and hyperscale data centers combines GaN power ICs with third-generation SiC MOSFETs. The SiC components, developed through two decades of research, use a trench-assisted planar technology that reduces case temperatures by up to 25°C compared to current devices. Testing indicates this temperature reduction can extend component lifespan by a factor of three.

The semiconductor advances include motor drive ICs for appliance and industrial applications, along with 650V bi-directional GaN technology for power conversion. New SiC modules target power grid infrastructure, renewable energy systems, EV charging stations, and uninterruptible power supplies.

Analysis from Yole Group indicates GaN and SiC technologies may represent 30% of the power semiconductor market by 2027, driven by demand for higher efficiency in data centers and electric vehicles. The technology’s reduced carbon footprint could contribute to CO2 emissions reduction targets through improved power conversion efficiency.

Technical discussions at the conference will examine how wide bandgap semiconductors can address thermal management challenges in high-power applications.

The technologies will be displayed at Hall C3, booth #129 at Trade Fair Center Messe München from November 12th-15th, 2024.

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The suite streamlines development and testing, providing real-time parameter monitoring for valuable insights into motor performance, efficiency, and reliability. This enables engineers to quickly identify issues, optimize designs, and enhance overall functionality. It offers effortless and accurate board setup, comprehensive signal analysis, and customized status monitoring. ModusToolbox Motor Suite features automatic detection and recognition of supported boards and kits, real-time visualization, and monitoring of motor control related signals. It also provides optimized system performance with pre-configured algorithms and real-time monitoring of critical system parameters. Additionally, the solution offers sophisticated algorithms that ensure control robustness across many motor types and applications. It currently includes out-of-the-box support for Infineon’s XMC7000 microcontrollers and will further expand its capability to include industrial MCUs, with PSOC Control integration confirmed for upcoming releases.

In addition to its comprehensive feature set, the ModusToolbox Motor Suite is designed to be highly versatile and easy to use. It provides a seamless graphical user interface for motor control development and an easily adaptable, hardware-abstracted motor control core library.

Infineon will showcase a demo featuring the ModusToolbox Motor Suite at electronica 2024 in Munich from 12 to 15 November (Hall C3, Booth 502).

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