Convection cooling is used in various devices, from mobile phone handsets to various consumer, communications, and industrial systems where the thermal loading is not too demanding. Devices such as heatsinks, heat spreaders, and heat pipes are used to implement convection cooling. Convection cooling systems are often classified as either passive or active. Active cooling systems […]
Heatsinks
Tube-shaped thermal interface material for hot transistors
Fujipoly tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating component. Once […]
Ultra-high performance heat sinks include active models with integral blowers
Advanced Thermal Solutions, Inc, ATS, now provides a family of ultra-high performance heat sinks for cooling high powered CPUs, GPUs, FPGAs and AI processors. This ultra-cool family includes active heat sinks with integral blowers, and passive heat sinks that use available airflow to provide thermal management. The active heat sinks, dualFLOW and quadFLOW are designed […]
New website enables fast access to thermal management product selection and design support
Laird Thermal Systems, an end-to-end thermal management solution provider, has developed the industry’s most efficient resource for design engineers to specify, search and select the optimum thermoelectric module, thermoelectric assembly or liquid cooling system for their application. The lairdthermal.com website enables customers to quickly find their ideal thermal management solution, shorten product design cycles and […]
Heat sinks, Part 2: Available components
Part 1 of this FAQ looked at the basic issues associated with cooling and heat sinks. Part 2 focuses on the various heat sinks available. Q: Are heat sinks limited to a single component such as an IC? A: No, there are heat sinks which fit entire unit or chassis cool such as those which […]
Heat sinks, Part 1: Thermal principles
A heat sink is a non-electronic, passive mechanical component that has a vital role in the reliability and performance of ICs, PC boards, modules, chassis, and more. Heat sinks often don’t get much attention, at least not in the early stages of a design. This FAQ will look at the basic thermal principles of these […]
SuperCool thermoelectric assembly increases cooling performance by up to 60%
Laird has launched a hhigh-performance thermoelectric assembly (TEA) series for indoor lab environments that offers a higher cooling performance per unit volume than competing systems. The SuperCool Series TEA features a unique hot side air heat sink design that dissipates heat more efficiently than competing heat exchanger technologies. Utilizing optimized thermoelectric modules (TEMs) in combination with a […]
Distributor Sager expands thermal management offering
Sager Electronics, a leading North American distributor of Interconnect, Power and Electromechanical components and provider of value-add solutions, today announced that additional thermal management products have been added to its specialized group, Sager Power Systems. “As an authorized distributor for many of the industry’s leading providers of thermal management solutions, Sager is committed to providing […]
Finned liquid cold plates perform 30% better
A new line of high-performance liquid cold plates are constructed with an innovative fin design, featuring an optimized aspect ratio, which offers more than 30% improvement in thermal performance compared to other commercially-available cold plates. The cold plates are lightweight and compatible with industry-accepted coolants. They have been leak-tested to 100 psi and feature industry-standard […]
