Power Electronic Tips

2 A Shottky diodes shrink in size, save PCB space

Redding Traiger — Fri, 15 Mar 2024 18:44:26 +0000

Diodes Incorporated announces its SDT2U30CP3 (30V/2A), SDT2U40CP3 (40V/2A), and SDT2U60CP3 (60V/2A) achieve the industry’s highest current densities in their class with low forward voltage drop and thermal resistance addressing design challenges for smaller and more efficient portable, mobile, and wearable devices. This series of innovative high-current trench Schottky rectifiers is housed in a chip-scale package (CSP) that occupies only 0.84mm² board space. They can be employed for a variety of different purposes, serving as blocking or reverse-polarity protection diodes, boost diodes, and switching diodes.

The trio are the first ever 2A trench Schottky rectifiers to be designed into the X3-DSN1406-2 package, making these the industry’s smallest in their class. Compared with similar SMB-packaged devices, they take up a mere 3.4% of the PCB area. These ultra-thin CSPs, featuring a typical profile of 0.25mm, also shorten thermal paths. This results in enhanced power dissipation, ultimately reducing thermal bill-of-materials costs and significantly increasing overall system reliability.

Their ultra-low forward voltage performance, typically 480mV (580mV for the SDT2U60CP3), minimizes power losses, enabling the design of higher efficiency systems. They have superior avalanche capability compared to other products in the same range, ensuring robustness in extreme operating conditions, such as transient voltages, and providing an extra layer of reliability. Furthermore, these devices are totally lead-free and fully compliant with RoHS 3.0 standards, contributing to environmentally responsible designs.

The SDT2U30CP3, SDT2U40CP3, and SDT2U60CP3 rectifiers are available at unit prices of $0.16, $0.17, and $0.19 respectively in 2,500 piece quantities.

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APEC 2024 to include workshop on wireless power technology

Redding Traiger — Tue, 02 Jan 2024 18:55:47 +0000

The purpose and focus of the workshop are to identify the latest improvements in wireless power technology and will cover the different dimensions to successfully integrate these new technologies into products. These include the technical foundation, innovations in power electronics semiconductors technologies, use cases, industry standards, common engineering challenges, regulatory and safety requirements, and how to conquer them.

Product designers looking to overcome the rigid limitations of first-generation wireless power technologies, to provide increased spatial freedom and the ability to charge multiple devices from a single transmitter simultaneously, will greatly benefit from the course. The target audiences for the Next Generation Wireless Power Workshop include wireless power system designers for consumer electronics, robots, autonomous vehicles, IoT devices, medical devices, and others. The target audiences also include people involved in the wireless power industry supply chain ranging from manufacturers of Power ICs including GaN, magnetic materials and structures, fabricators of magnetic components, providers of modeling and simulation software as well as manufacturers of test and characterization equipment.

The workshop will address several market applications including consumer electronics, IOT devices (including those that are batteryless), wearable and implantable devices, personal mobility devices, autonomous devices, etc. The workshop will include presentations and demonstrations to address specific technical issues.

The workshop will open with a keynote presentation that will provide an overview of wireless power technologies and the key technical concepts. We will discuss the technical advancements driving the evolution of the 2nd generation wireless power technologies and the experiential benefits enabled. We will then cover Magnetic Resonance and RF Harvesting technologies in detail, how to determine which technology is most appropriate for a given use case, integrating them into your product, relevant design trade-offs to be considered, and so on. We will conclude by discussing the safety and regulatory requirements for wireless power and why it is essential to factor these into the design at the start. There will be ample opportunity for Q&A during each presentation.

During the provided breakfast, lunch, and the networking hour at the end of the workshop there will be interactive tabletop technology demonstrations each addressing specific technical disciplines and capabilities consistent with the workshop agenda. Interaction between the attendees and the presenters is highly encouraged.

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Tiny ESD devices target wearables market

Redding Traiger — Wed, 01 Nov 2023 19:18:18 +0000

Taiwan Semiconductor announces its new TESD Series of single-channel ESD clamping diodes offering size and performance specifications optimized for wearable applications. The new TESD devices’ unique design features proprietary bidirectional clamping cells (for ESD protection up to ±30kV) in an ultra-small DFN0603 package.

The devices in the new TESD Series are offered in versions with 5.0V and 3.3V (max.) operating voltages and provide protection in compliance with IEC61000-4-2 (ESD) to ±20kV (air/contact) and IEC61000-4-5 (lightning) to 4.5A (8/20µs). A second 3.3V model in the series increases these specs to ±30kV and 8.2A, respectively.

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