Power Electronic Tips

Lead-free alloy solder paste addresses thermal fatigue in AI applications

Redding Traiger — Mon, 14 Oct 2024 18:55:14 +0000

SHENMAO America, Inc. announces the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates. This no-clean, halogen-free solder paste offers exceptional anti-thermal fatigue reliability, making it an ideal solution for demanding AI applications.

The PF719-P250A solder paste utilizes a newly developed, high-reliability lead-free alloy that provides excellent anti-thermal fatigue performance. It is halogen-free (ROL0) with no halogen intentionally added, ensuring compliance with RoHS, RoHS 2.0, and REACH regulations. Additionally, PF719-P250A offers superior voiding performance, reducing voids during the soldering process, and delivers excellent resistance to multiple reflows while maintaining optimal solderability and printability.

SHENMAO’s PF719-P250A has already been certified by major power management module manufacturers and has entered the mainstream AI substrate supply chain, solidifying its status as a reliable and high-performance solder paste for advanced electronics manufacturing.

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Dual-channel gate drivers offer thermal management for inverter modules

Redding Traiger — Wed, 22 May 2024 00:20:40 +0000

Power Integrations has announced the launch of the SCALE-iFlex XLT family of dual-channel plug-and-play gate drivers. These drivers are designed for the operation of single LV100 (Mitsubishi), XHP 2 (Infineon), HPnC (Fuji Electric), and equivalent semiconductor modules up to 2300 V blocking voltage. The new gate drivers are suitable for wind, energy storage, and solar renewable energy installations. This single-board driver enables active thermal management of inverter modules for improved system utilization and reduces the bill-of-material count for increased reliability.

The SCALE-iFlex XLT dual-channel gate drivers feature Negative Temperature Coefficient (NTC) data reporting, providing an isolated temperature measurement of the power module. This allows accurate thermal management of converter systems. System designers can optimize thermal design and obtain a 25 to 30 percent converter power increase from the same hardware. The isolated NTC readout also reduces hardware complexity by eliminating multiple cables, connectors, and additional isolation barrier crossing circuits.

The new gate drivers employ Power Integrations’ SCALE-2 chip set, minimizing component count and enhancing reliability. The gate driver board also protects the power switches in the event of a short-circuit.

SCALE-iFlex XLT plug-and-play gate drivers are available for sampling now.

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A new technique for improving performance in Peltier modules

Aimee Kalnoskas — Sat, 12 Nov 2022 02:37:54 +0000

Peltier modules or thermoelectric coolers (TEC) have grown in popularity and found uses in many applications due their reliable solid-state construction and precise temperature control. They operate by transferring heat from one side of the module to the other when electrical power is applied. Although all Peltier devices are constructed using the same general structure, enhancements can be made to increase performance and cycle life.

CUI Devices’ arcTEC structure is one such advanced construction technique that utilizes three enhancements (thermally conductive resin, high temperature solder, and larger P/N elements) to greatly improve performance, reliability, and lifespan.

The CUI Insights blog post, “arcTEC Structure – Improved Performance and Longer Life in Peltier Modules” dives into these improvements in more detail, while providing an overview of Peltier module technology.

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