Power Electronic Tips

700 V chip features 120 mΩ rating in DPAK-4L package

Redding Traiger — Tue, 22 Oct 2024 18:10:51 +0000

Navitas Semiconductor has announced GaNSlim, a new generation of highly integrated GaN power ICs that will further simplify and speed the development of small form factor, high-power-density applications by offering the highest level of integration and thermal performance.

GaNSlim enables the simplest, fastest, and smallest system design by integrating drive, control, and protection, with integrated EMI control and loss-less current sensing, all within a high thermal performance proprietary DPAK-4L package. Additionally, with an ultra-low startup current below 10 µA, GaNSlim devices are compatible with industry-standard SOT23-6 controllers and eliminate HV startup.

Integrated features such as loss-less current sensing eliminate external current sensing resistors and optimize system efficiency and reliability. Over-temperature protection ensures system robustness and auto sleep mode increases light and no-load efficiency. Autonomous turn-on/off slew rate control maximizes efficiency and power density while reducing external component count, system cost, and EMI.

GaNSlim features a patented, 4-pin, high-thermal-performance, low-profile, low-inductance, DPAK package. This package enables 7 °C lower temperature operation versus conventional alternatives, supporting high-power-density designs with ratings up to 500 W. Target applications include chargers for mobile devices and laptops, TV power supplies, lighting, etc.

Devices in the NV614x GaNSlim family are rated at 700 V with RDS(ON) ratings from 120 mΩ to 330 mΩ and are available in versions optimized for both isolated and non-isolated topologies.

As with other Navitas GaN ICs, GaNSlim devices are supplied with an industry-leading twenty-year warranty, while demo boards for QR flyback, single-stage PFC, boost PFC plus QR flyback and TV power supply designs allow for rapid evaluation and selection of the optimum device for a given application.

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Rectifiers offer robust ESD protection for automotive applications

Redding Traiger — Wed, 28 Feb 2024 20:17:05 +0000

Taiwan Semiconductor announces its new line of automotive-qualified rectifiers featuring ESD withstand capability. The new TSD Series rectifiers simultaneously provide repetitive peak reverse voltage (V_RRM) of up to 600V as well as ESD protection of >10,000V (per IEC-61000-4-2). Devices in the series have optional current ratings of 1A, 2A, and 3A, and operating temperature ranges from -40°C to ±175°C. All have a maximum forward voltage drop of 1.1V and feature low-reverse leakage current and fast response time.

Qualified to automotive standards, the TSD Series offers superior protection in a range of applications. These include input polarity protection where DC input voltage is applied; bridge and general purpose rectification circuits; LED strings and POE I/O protection, ESD protection, clamping, snubber networks and transient protection for datacom systems. They also provide reliable protection for smoke detectors, industrial controls, security systems, communication systems, lighting, and other systems that depend on continuous operation.

Click here for more information and links to complete product specifications. Design resources include comprehensive datasheets and spice models for each component in the series.

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Schottkys in DPACK footprint offer drop-in improvements in power density, thermal performance.

Redding Traiger — Wed, 27 Sep 2023 17:16:13 +0000

Taiwan Semiconductor announces its new ThinDPAK family of ultra-fast-recovery Schottky rectifiers. ThinDPAK devices have the same footprint as standard DPAKs – but come in a thinner (1.33mm) package and offer superior power density and thermal performance. Fully AEC-Q qualified with a maximum operating temperature (T_j, max) of 175°C and typical reverse-recovery time of 25ns, ThinDPAKs assure reliability in automotive power electronics, high-frequency inverters, steering diodes in HV applications, DC/DC converters, as freewheeling diodes, reverse battery protection, lighting, and many other applications.

The planar Schottky topology of advanced ThinDPAK devices provides industry-leading rectification efficiency that dissipates less heat than alternatives. For the heat that is dissipated, the new ThinDPAK devices’ thermal resistance (R_j_∅_A) is 21.9% lower. Moreover, the devices save both weight and headroom compared to standard DPAKs.

The ThinDPAK series comprises a selection of 34 devices with reverse voltage (V_VRRM) ratings from 45Vdc to 200Vdc with current ratings up to 150A. Devices are available in single and dual (common cathode) configurations.

Click here for more information and links to complete product specifications. Design resources include comprehensive datasheets and spice models for each component in the series.

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