The HL7543 features an input voltage range between 2.3V to 5.5V delivering up to 600mA high efficiency while maintaining over 90% efficiency at load current as low as 10A. Its wide range of output capacitors can be used to optimize VOUT stability during load transients, and inductors of 2.2H may be used without affecting loop stability.

The HL7543 operates at a high frequency of 1.2MHz, greatly reducing the value of the required external components. At moderate to light loads, the Pulse Frequency Modulation (PFM) is used to maintain conversion efficiency with non-switching quiescent currents. The HL7543 maintains excellent load and line transient responses even with such a low quiescent current. The system automatically switches to fixed-frequency Pulse Width Modulation (PWM) operation at 1.2MHz for minimum VOUT ripple and optimal load transient response at higher loads. In shutdown mode, the HL7543’s supply current drops below 270nA, significantly reducing power consumption.

The HL7543 comes in a compact 1.6mm x 0.9mm WLCSP-8 package; the ideal choice for wearable devices with limited space. Primary applications include wearables, fitness trackers, and smartwatches.

For more information about the HL7543, please visit www.halomicro.com.

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Nexperia

Nexperia’s NEH2000BY PMIC makes it much easier to design energy harvesting solutions that can be up to 20x smaller than other competing offerings and do not require manual optimization for individual applications. In addition, the PMIC was designed without inductors, simplifying PCB design and significantly reducing overall BOM and board size, with a 12 mm² assembly area.

To achieve the highest conversion efficiency, energy harvesting solutions must be able to adapt as the ambient energy source fluctuates. The NEH2000BY performs Maximum Power Point Tracking (MPPT), an adaptive algorithm to optimize how it transfers harvested energy and to achieve optimum average conversion efficiency by up to 80%. This unique MPPT algorithm combines speed with accuracy, allowing the PMIC to adapt to environmental changes in less than a second. This is significantly faster than any other currently available solution and maximizes the amount of energy harvested over the course of a day, vastly expanding the number of application areas. Furthermore, due to its self-optimization functionality and ability to operate autonomously without the requirement for pre-programming, the NEH2000BY makes it easier for designers to power devices with ambient energy.

Nexperia’s energy harvesting solutions enable economical energy harvesting from various ambient sources in applications consuming up to several milliwatts of power, including wireless IoT nodes, wearable smart tags, and electronic shelf labels.

The NEH2000BY is available in a 16-lead, 3 mm × 3 mm QFN package and operates between -40 °C and +85 °C.

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ROHM Semiconductor

In recent years, the increasing sophistication and power requirements of compact devices have resulted in larger batteries that reduce the space available for mounting components. At the same time, there is a limit to the size of the battery, so to ensure more efficient use of battery power the power loss of mounted components must be minimized.

To meet this need, the development of MOSFETs in wafer-level, chip-size packages (WLCSP) that contribute to greater miniaturization while maintaining the necessary characteristics is becoming mainstream in the industry. ROHM leverages its strengths as an IC manufacturer to significantly reduce wiring resistance, which has increased with conventional discrete processes. The result is a compact power MOSFET that delivers low power loss.

The RA1C030LD is offered in the DSN1006-3 wafer-level, chip-size package (1.0mm × 0.6mm) that takes advantage of ROHM’s proprietary IC process to achieve low power dissipation together with greater miniaturization. In terms of the figure of merit that expresses the relationship between conduction and switching losses (ON resistance × Qgd), an industry-leading value has been achieved that is 20% lower than standard package products in the same package (1.0mm × 0.6mm or smaller), contributing to a significantly smaller board area, along with higher efficiency in a variety of compact devices. At the same time, ROHM’s unique package structure provides insulated protection for the side walls (unlike standard products in the same package with no protection). This reduces the risk of short-circuit due to contact between components in compact devices that must resort to high-density mounting due to space constraints, contributing to safer operation.

Sales of the RA1C030LD launch December 2022.

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